Device Engineer

onsemi is seeking a highly motivated individual to join our Device Engineering / Yield Enhancement group in Gresham, OR.  An Engineer in this position will work with other Engineers and Technicians in a fast-paced Silicon wafer fab production and technology development environment.  Primary technology nodes range from sub-0.18um to 0.5um.  Group responsibilities include Yield Enhancement (both wafer level and die level), Technology Transfers, New Product Introduction, and other production sustaining/optimization activities.  This position will build upon your Semiconductor device knowledge across the entire Silicon manufacturing chain (from bare wafers to finished goods), with a significant focus on fab manufacturability.  Communication skills will be important, since this position regularly interfaces with in-house Fab Process Engineering, Technology Development, Failure Analysis, Design/Layout, wafer probe/test, in-line defect control, Quality, and Business Unit part owners and managers.

Responsibilities will include one or more of the following:

• Yield enhancement for production products
• New product introduction into the Fab
• Scrap reduction and prevention.
• Process improvements using existing and newly acquired process equipment, often working directly with Process Engineering
  • Minimize variation (lot to lot, wafer to wafer, product to product)
  • Lower cost
  • Improve throughput
  • Lower defectivity
  • Standardization / Best Known Methods
• Analyze manufacturing and test data to improve product performance
• Ensure all shipped material meets requirements
• Present trends, KPIs, and process improvements to management team

 

Qualifications: 

• BS/MS or equivalent in Engineering, with BSEE/MSEE preferred.  Will also consider Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field
• Broad understanding of semiconductor devices, such as CMOS, DMOS, and Bipolars
• 5+ years of experience in semiconductor process technology and wafer fabrication
• Problem-solving mindset 
• Comfortable using data analysis and statistics to reach conclusions
• Concise and clear written and oral communication skills
• Strong interpersonal skills

Desired: 

• Experience in one or more of the following engineering disciplines: Process/Device Integration, Circuit Design / Simulation, Test (parametric, circuit), Process Engineering 
• Experience with DOE and experiment analysis
• 10+ years of experience in semiconductor process technology and wafer fabrication
• Ability to relate product circuit performance to semiconductor device parameters 
• Knowledge of post-fab product manufacturing (ex: assembly, and test) 
• Ability to debug issues at any point in a product manufacturing sequence
• Hands-on knowledge of GDS layout viewing and editing